IC Package Development Engineer

Your mission

Package Selection: Choose an appropriate IC package type based on given specs and IC requirements.
Comprehensive Analysis: Evaluate chosen package's electrical, thermal, and mechanical characteristics. Identify potential limitations.
Electrical Performance Optimization: Enhance signal integrity, power integrity, and EMC of the IC package. Address routing, parasitic effects, and noise issues.
Design for Manufacturability: Ensure compatibility with manufacturing processes, assembly requirements, and material availability. Optimize for cost.
Documentation and Reporting: Create a detailed report summarizing analysis, design modifications, and optimization recommendations.
Communication: Clearly convey design rationale and its impact on IC performance and reliability.

Master's degree in electronics
At least 2 years of experience in a relevant field.
Proficiency in Cadence layout tool and Ansys tool. Familiarity with 2.5D/3D packaging, silicon layout (place & route) is a plus.
Understanding: Strong grasp of Signal & Power Integrity analysis.
Language: Fluent in English.
Problem-Solving: Strong problem-solving skills and behavior.

A motivating salary package, with the possibility of working from home and a company car
Improve your skillset within challenging mid to long-term R&D projects in a variety of high tech industries
Join an inspiring community of engineers with a range in expertise and experience levels
Work in a people-oriented company in an informal working environment
Support in your professional career from a business team providing technical and business related trainings